北京科技大学学报Issue(4)：489-495,7.DOI:10.13374/j.issn1001-053x.2014.04.011
伪半固态触变成形制备SiCp/Al电子封装材料的组织与性能
Microstructure and properties of SiCp/Al electronic packaging materials fabricated by pseudo-semi-solid thixoforming
郭明海 1刘俊友 1贾成厂 1果世驹 1李艳霞 2周洪宇1
作者信息
- 1. 北京科技大学材料科学与工程学院，北京100083
- 2. 北华航天工业学院材料系，廊坊065000
- 折叠
摘要
Abstract
SiC particles reinforced Al matrix composites with three different SiC volume fractions of 40%, 56% and 63% for elec-tronic packaging were prepared by pseudo-semi-solid thixoforming. The Al and SiC distribution and the fractographs of the SiCp/Al electronic packaging materials were examined by optical microscopy and scanning electron microscopy. The density, relative density, thermal conductivity ( TC) , coefficient of thermal expansion ( CTE) , compressive strength and bending strength of the SiCp/Al elec-tronic packaging materials were tested. It is found that the SiCp/Al electronic packaging materials have controllable coefficients of ther-mal expansion and high relative density. The Al matrix is connected into a network, and SiC particles are uniformly distributed in the Al matrix. When the SiC volume fraction increases, the density and thermal conductivity at room temperature lightly increase, the coef-ficient of thermal expansion gradually decreases, and the compressive strength and bending strength increase. The main fracture mode of the SiC/Al electronic packaging materials is brittle fracture of SiC particles accompanied by ductile fracture of the Al matrix at the same time.关键词
电子封装/颗粒增强复合材料/触变成形/热导率/热膨胀/材料强度Key words
electronic packaging/particle reinforced composites/thixoforming/thermal conductivity/thermal expansion/strength of materials分类
信息技术与安全科学引用本文复制引用
郭明海,刘俊友,贾成厂,果世驹,李艳霞,周洪宇..伪半固态触变成形制备SiCp/Al电子封装材料的组织与性能[J].北京科技大学学报,2014,(4):489-495,7.
