电讯技术Issue(4)：518-523,6.DOI:10.3969/j.issn.1001-893x.2014.04.027
差分过孔的高频特性仿真分析
Simulation Analysis of Differential Via's High Frequency Characteristics
摘要
Abstract
To satisfy the design requests of differential vias for multi-purpose, low reflectance, high trans-mission coefficient and impedance stabilization in high-speed PCB, an optimization design method for stub and non-function pads is proposed, and the model, simulation and theoretical analysis are provided. Three-dimensional differential vias in 12 layers PCB are modelled and simulated with HFSS, and the eye dia-gram is analyzed with ADS. The results shown that drilling out the stub can improve the high-frequency transmission characteristics of the differential via effectively, wherein the reflected energy reduces 79. 1%, the transferred energy increases 82 . 1%; and removing the non-function pads can improve the high-fre-quency transmission characteristics of the differential via further, wherein the reflected energy reduces 14 . 46%, the transferred energy increases 14 . 13%.关键词
高速PCB/信号完整性/差分过孔/非功能焊盘/眼图/高频特性Key words
high-speed PCB/signal integrity/differential via/non-function pad/eye diagram/high fre-quency characteristics分类
信息技术与安全科学引用本文复制引用
赵玲宝,陈清华..差分过孔的高频特性仿真分析[J].电讯技术,2014,(4):518-523,6.基金项目
浙江省科技专项(2012C01037-1) （2012C01037-1）
嘉兴市科技项目(2011AZ1013) （2011AZ1013）
江苏省基础研究计划资助项目(BK2010137)@@@@Science & Technology Specific Projects of Zhejiang Province (2012C02037-1) （BK2010137）
Science & Technology Projects of Jiaxing (2011AZ1013) （2011AZ1013）
Projects Funded by Jiangsu Province Basic Pesearch Program(BK2010137) （BK2010137）
