桂林电子科技大学学报Issue(1)：21-24,4.
QFP器件激光软钎焊温度场的建模与仿真
QFP device laser soldering temperature field modeling and simulation
摘要
Abstract
In order to solve the problem of temperature distribution of the QFP device after the laser soldering under different process parameters,three welding parameters (effective power,time,and spot area)are selected,the finite element soft-ware ANSYS is used to simulate temperature field distribution of the specific QFP device.The simulation result shows that laser welding effective power and spot area are almost linear relationship with the highest temperature of the solder joint, and that time is positive correlation in which the tangent slope decreases slowly.When the effective power is in 1-4 W,time is in 1-2 s and spot area is in 0.03-0.1 1 mm2 ,the highest temperature of plastic package,printed board and solder joint can reach 240,350,5 10 ℃.The simulation results can provide references for primary election of the laser welding technological parameter and lay a basis for the laser soldering integrated parameters optimization of relative products.关键词
QFP器件/激光软钎焊/温度场/数值模拟Key words
QFP device/laser soldering/temperature field/numerical simulation分类
矿业与冶金引用本文复制引用
刘炜,周德俭..QFP器件激光软钎焊温度场的建模与仿真[J].桂林电子科技大学学报,2014,(1):21-24,4.基金项目
预研项目“光电互联***技术研究” （）
