微型机与应用Issue(1)：25-27,3.
基于ARM和FPGA的SiP系统级封装设计
Design of system in package based on ARM and FPGA
摘要
Abstract
The concept and characteristics of SiP are introduced in the paper, and the key design technologies and produce flows are illustrated. A micro-processing system based on ARM and FPGA chip cores is designed in SiP form. The paper describes the overall structure and hardware circuits of the system in detail. The system has advantages like small, low consumption, complete functions etc, and the excellence performances of SiP are adequately displayed in the system.关键词
系统级封装/ARM/FPGA/管芯Key words
system in package/ARM/FPGA/chip core分类
信息技术与安全科学引用本文复制引用
代明清,韩强,邓豹,段小虎..基于ARM和FPGA的SiP系统级封装设计[J].微型机与应用,2014,(1):25-27,3.基金项目
装备预研共用技术基金项目 （）
