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电真空器件玻璃封接工艺研究

马迎英 欧丽 梁力 张强 陶青 万瑞芸

现代电子技术Issue(20):148-152,5.
现代电子技术Issue(20):148-152,5.

电真空器件玻璃封接工艺研究

Study on glass sealing technics of electronic vacuum devices

马迎英 1欧丽 1梁力 1张强 1陶青 1万瑞芸1

作者信息

  • 1. 中国工程物理研究院 电子工程研究所,四川 绵阳 621900
  • 折叠

摘要

Abstract

The problems such as gas-tightness,strength and stability,which would appear in glass sealing practical opera-tion of electronic vacuum devices,including bubble,abnormal sealing color,overproof welt size in glass-Kovar sealing,and de-vitrification and pulverization phenomena in glass-glass sealing,were summarized in this paper. The reasons of these phenomena were researched by means of various modern technology means,technologies and theory. Some experiments to improve the quali-ty and feasibility of glass sealing products were carried out. Thus,scientific research and production could go on wheels by these measures.

关键词

玻璃封接/电真空器件/质量分析/可靠性提高

Key words

glass sealing/electronic vacuum device/quality analysis/feasibility improvement

分类

信息技术与安全科学

引用本文复制引用

马迎英,欧丽,梁力,张强,陶青,万瑞芸..电真空器件玻璃封接工艺研究[J].现代电子技术,2013,(20):148-152,5.

基金项目

国家自然科学基金 ()

现代电子技术

OACSTPCD

1004-373X

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