现代电子技术Issue(2)：138-143,6.
长期贮存对气密性封装的影响研究
Research on influence of long-term storage on hermetic package
翁正 1周建洪 1刘红民2
作者信息
- 1. 辽宁科技大学，辽宁 鞍山 114005
- 2. 中国科学院 空间科学与应用研究中心，北京 100190
- 折叠
摘要
Abstract
Hermetic package components have an absolute monopoly position in condition which requires high reliability. To study about the influence of long-term storage on the package performance of hermetic package microelectronic components, several kinds of hermetic package microelectronic components stored in a storeroom in a Beijing research institute were analyzed. A conclusion on the influence of long-term storage on the package performance of hermetic package components was achieved with destructive physical analysis(DPA)methods as seal test to carry out seal performance,internal morphology,bond strength and chip bonding intensity test. The stored components were classified according to the results of seal performance test. The package performance data of qualified and unqualified products in long-term storage was obtained. The influence of seal perfor-mance on storage reliability was researched. All this does great help for screening and long-tern storage of hermetic package com-ponents.关键词
长期贮存/气密性封装/封装可靠性/DPAKey words
long-term storage/hermetic package/package reliability/DPA分类
信息技术与安全科学引用本文复制引用
翁正,周建洪,刘红民..长期贮存对气密性封装的影响研究[J].现代电子技术,2014,(2):138-143,6.
