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一种基于厚膜工艺的电路版图设计

蒲亚芳

现代电子技术Issue(4):118-120,3.
现代电子技术Issue(4):118-120,3.

一种基于厚膜工艺的电路版图设计

Circuit layout design based on thick-film process

蒲亚芳1

作者信息

  • 1. 陕西华经微电子股份有限公司,陕西 西安 710065
  • 折叠

摘要

Abstract

The printed circuit board(PCB)technology is applied to circuit design generally. If it is combined with thick-film process,the circuit layout design,in which the complicated connection and many devices are mounted in its limited room, can be implemented. The outstanding advantages of the thick-film hybrid circuit were demonstrated by theoretical analysis of three defferent design schemes of circuit layout design. It is the unique one which can meet the requirement of the circuit design scheme. According to the boundary dimension requirement of the circuit,the circuit performance and device encapsulation mode were considered thoroughly,and the rationality and realizability of the design scheme were validated by reasonable circuit seg-menting design and layout design. The outstanding superiority of thick-film process was reflected in the circuit layout design. The difficulty that the conventional methods for circuit layout design could not overcome was solved easily .

关键词

电路版图设计/电路分割设计/厚膜混合集成电路/厚膜工艺

Key words

circuit layout design/circuit segmenting design/thick-film hybrid circuit/thick-film process

分类

信息技术与安全科学

引用本文复制引用

蒲亚芳..一种基于厚膜工艺的电路版图设计[J].现代电子技术,2014,(4):118-120,3.

现代电子技术

OA北大核心CSTPCD

1004-373X

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