现代电子技术Issue(6)：81-82,87,3.
三维装配工艺技术在复杂电子产品中的应用
Application for three-dimensional assembly technology in complex electronic products
蔡萍1
作者信息
- 1. 西安导航技术研究所，陕西 西安 710068
- 折叠
摘要
Abstract
Assembly is an important part in the lifecycle of products. The assembly process of complex electronic products wastes time and energy. To improve assembly quality and efficiency of complex electronic products,the assembly process charac-teristics and status of radar and other complex electronic products were analyzed,and a method for three-dimensional model as-sembly process design,simulation and application based on MBD was proposed. A new three-dimensional assembly process plan-ning system was established based on the application requirement. The key technologies involved in the system are analyzed in this paper. This method provides an important support for three-dimensional process planning technology application. It is meaningful for the manufacturing industry which attempts to develop the digitalization assembly technology.关键词
复杂电子产品/三维装配工艺技术/MBD/可视化Key words
complex electronic product/three-dimensional assembly process technology/model-based definition/visualiza-tion分类
信息技术与安全科学引用本文复制引用
蔡萍..三维装配工艺技术在复杂电子产品中的应用[J].现代电子技术,2014,(6):81-82,87,3.
