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In situ TEM/SEM electronic/mechanical characterization of nano material with MEMS chip

Wang Yuelin Li Tie Zhang Xiao Zeng Hongjiang Jin Qinhua

半导体学报（英文版）2014，Vol.35Issue(8)：1-9,9.

半导体学报（英文版）2014，Vol.35Issue(8)：1-9,9.DOI:10.1088/1674-4926/35/8/081001

In situ TEM/SEM electronic/mechanical characterization of nano material with MEMS chip

Wang Yuelin ¹Li Tie ¹Zhang Xiao ¹Zeng Hongjiang ¹Jin Qinhua¹

作者信息

1. Science and Technology on Micro-System Laboratory, Shanghai Institute of Microsystem and Information Technology,Chinese Academy of Sciences, Shanghai 200050, China
折叠

摘要

关键词

MEMS/ nanoscale/ tensile/ in situ/ TEM/SEM

Key words

MEMS/ nanoscale/ tensile/ in situ/ TEM/SEM

引用本文复制引用

Wang Yuelin,Li Tie,Zhang Xiao,Zeng Hongjiang,Jin Qinhua..In situ TEM/SEM electronic/mechanical characterization of nano material with MEMS chip[J].半导体学报（英文版）,2014,35(8):1-9,9.

基金项目

Project supported by the National Basic Research Program of China (Nos.2011 CB309501,2012CB934102),the National Hi-Tech Research and Development Program of China (No.SS2012AA040402),the National Science and Technology Supporting Program of China (No.2012BAJ11B01),the Fund for Creative Research of NSFC (No.61321492),the Key Project of NSFC (Nos.91323304,91123037),the FP7-PEOPLE-2010-IRSES Project ECNANOMAN (No.269219),and the Shanghai International Sci.& Tech.Cooperation Foundation Project (No.12410707300). （Nos.2011 CB309501,2012CB934102）

半导体学报（英文版）

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ISSN：1674-4926

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