首页|期刊导航|半导体学报（英文版）|Finite element analysis on factors influencing the clamping force in an electrostatic chuck

Finite element analysis on factors influencing the clamping force in an electrostatic chuck

Wang Xingkuo Cheng Jia Wang Kesheng Yang Yiyong Sun Yuchun Cao Minglu Ji Linhong

半导体学报（英文版）2014，Vol.35Issue(9)：87-91,5.

半导体学报（英文版）2014，Vol.35Issue(9)：87-91,5.DOI:10.1088/1674-4926/35/9/094011

Finite element analysis on factors influencing the clamping force in an electrostatic chuck

Wang Xingkuo ¹Cheng Jia ²Wang Kesheng ³Yang Yiyong ⁴Sun Yuchun ¹Cao Minglu ²Ji Linhong²

作者信息

1. School of Engineering and Technology, China University of Geosciences(Beijing), Beijing 100083, China
2. Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China
3. Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China
4. Department of Mechanical Engineering, Academy of Armored Force Engineering of PLA, Beijing 100072, China
折叠

摘要

关键词

electrostatic chuck/clamping force/COMSOL simulation/orthogonal experiment

Key words

electrostatic chuck/clamping force/COMSOL simulation/orthogonal experiment

引用本文复制引用

Wang Xingkuo,Cheng Jia,Wang Kesheng,Yang Yiyong,Sun Yuchun,Cao Minglu,Ji Linhong..Finite element analysis on factors influencing the clamping force in an electrostatic chuck[J].半导体学报（英文版）,2014,35(9):87-91,5.

基金项目

Project supported by the National Science and Technology Major Project No.02 (No.2011ZX02403). （No.2011ZX02403）

半导体学报（英文版）

OACSCDCSTPCDEI

ISSN：1674-4926

访问量4

下载量0

段落导航