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基于OLED器件的封装材料研究进展

张贾伟 张国平 孙蓉 李世玮 汪正平

集成技术Issue(6):92-101,10.
集成技术Issue(6):92-101,10.

基于OLED器件的封装材料研究进展

Research Progress of Encapsulation Materials for OLED

张贾伟 1张国平 1孙蓉 1李世玮 2汪正平3

作者信息

  • 1. 中国科学院深圳先进技术研究院 深圳 518055
  • 2. 香港中文大学 香港 999077
  • 3. 香港科技大学机械工程系 香港 999077
  • 折叠

摘要

Abstract

As a potential new generation display technology, OLED has many advantages such as light weight, wide visual angle, quick response, high luminous efifciency and low cost. The research and development of OLED encapsulation materials is to prevent corrosion by oxygen and moisture from the external environment and prolong the lifetime of organic emitting materials. Besides excellent barrier properties, OLED encapsulation materials also require good thermal conductivity, luminousness, mechanical strength, corrosion resistance and good adhesion to substrate and so on. In this paper, the development of OLED encapsulation materials was introduced in detail which cover the metal, glass and ceramic used for conventional encapsulation and inorganic compounds, polymers and composite materials used for the thin iflm encapsulation. The development direction of OLED encapsulation materials based on the demands of packaging methods in future was also discussed.

关键词

OLED/封装材料/阻隔性能

Key words

OLED/encapsulation materials/barrier properties

分类

信息技术与安全科学

引用本文复制引用

张贾伟,张国平,孙蓉,李世玮,汪正平..基于OLED器件的封装材料研究进展[J].集成技术,2014,(6):92-101,10.

基金项目

国家自然科学基金(21201175);广东省引进创新科研团队计划(2011D052);深圳市孔雀计划团队(KYPT20121228160843692);深圳市电子封装材料工程实验室(深发改【2012】372号) (21201175)

集成技术

2095-3135

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