半导体学报（英文版）2015，Vol.36Issue(6)：99-104,6.DOI:10.1088/1674-4926/36/6/065001
Propagation delay and power dissipation for different aspect ratio of single-walled carbon nanotube bundled TSV
Propagation delay and power dissipation for different aspect ratio of single-walled carbon nanotube bundled TSV
Tanu Goyal 1Manoj Kumar Majumder 2Brajesh Kumar Kaushik2
作者信息
- 1. Department of ECE, IEC College of Engineering and Technology, UP, India
- 2. Department of E&CE, Indian Institute of Technology Roorkee, Uttarakhand, India
- 折叠
摘要
关键词
carbon nanotube/through-silicon vias/equivalent RLC circuit model/propagation delay/power-delay product/area-delay productKey words
carbon nanotube/through-silicon vias/equivalent RLC circuit model/propagation delay/power-delay product/area-delay product引用本文复制引用
Tanu Goyal,Manoj Kumar Majumder,Brajesh Kumar Kaushik..Propagation delay and power dissipation for different aspect ratio of single-walled carbon nanotube bundled TSV[J].半导体学报（英文版）,2015,36(6):99-104,6.
