摘要
Abstract
ABSTRACT:Objective To study the dynamic characteristics of electroless tin plating reaction. Methods Using sodium hypophos-phite as the reducing agent, and SnCl2 as the main salt, electroless Sn was deposited on copper in the thiourea-citric acid-tartaric acid trinary ligand system. Influences of temperature, as well as the concentrations of main salt, reducing agent, hydrogenion and complexing agents on the deposition rate were investigated, respectively. Results The reaction orders of Sn2+, sodium hypophos-phite and H+ were 0. 302, 0. 192 and 0. 21,and those of thiourea, citric acid and tartaric acid were 0. 237, 0. 213 and 0. 081, re-spectively. The rate constant was 0. 013, the total reaction order was 1. 235, and the apparent activation energy was 11. 184 kJ/mol. Conclusion The kinetic equation of electroless tin plating reaction was established, which provides reference for the technology se-lection and product control in electroless tin deposition technology.关键词
化学镀/反应级数/动力学Key words
electroless plating/reaction order/kinetics分类
化学化工
