表面技术Issue(6)：144-148,5.
双酚A型酚醛树脂改性双氰胺固化环氧树脂行为的研究
Research on the Behavior of Dicyandiamide Modified by Bisphenol-A Type Phenolic Aldehyde Curing Epoxy Resin
摘要
Abstract
ABSTRACT:Objective To obtain a latent, low-temperature and fast curing dicyandiamide agent. Methods A new latent curing agent of dicyandiamide modified by bisphenol A type phenolic aldehyde resin was synthesized and the structure was characterized by FTIR spectra. The impact of dicyandiamide dosage on product performance was investigated. The activity of the modified curing a-gent, the dosage and the curing temperature were studied with differential scanning calorimetry ( DSC) . Results The results showed that the suitable molar ratio of dicyandiamide and phenolic aldehyde was 0. 6 : 1, the optimal dosage of the modified curing agent was 30% ( relative to the epoxy resin mass fraction) , and the constant curing temperature after modification was 127 ℃. Conclu-sions The resulting curing agent of bisphenol A phenolic resin modified dicyandiamide exhibited the best comprehensive perform-ances.关键词
酚醛/双氰胺/潜伏固化剂/改性Key words
phenolic aldehyde/dicyandiamide/latent curing agent/modification分类
化学化工引用本文复制引用
唐囡,杨又华,邓静伟,周建萍,刘志雷,刘光明..双酚A型酚醛树脂改性双氰胺固化环氧树脂行为的研究[J].表面技术,2014,(6):144-148,5.基金项目
国家电网公司科技项目(521820130014)Fund：Supported by State Grid Practical Project(521820130014) （521820130014）
