表面技术Issue(2)：1-7,18,8.DOI:10.16490/j.cnki.issn.1001-3660.2015.02.001
界面热力学在Sn晶须生长研究中的应用
Application of Interface Thermodynamics in Study on Sn Whisker Growth
摘要
Abstract
Objective To investigate the thermodynamic mechanisms of the intermetallic compound ( IMC ) formation and Sn whisker growth in Sn-Cu bilayer thin film system. Methods Using the interface thermodynamics theory, the IMC formation and the Sn whisker growth were studied through calculating the corresponding surface energies, interface energies and critical thickness. Results The IMC Cu6 Sn5 was firstly formed at the triple junction of Sn grain boundary and Sn/Cu interface and then grew along the Sn/Cu interface. The resulting stress gradient drove the diffusion of Sn atoms to the surface and formed Sn whisker on it. Conclu-sion The Sn whisker growth was caused by the IMC formation in Sn sublayer, based on which some methods were proposed for in-hibiting the growth of Sn whisker.关键词
界面热力学/金属间化合物相/Sn晶须/生长机制Key words
interface thermodynamics/intermetallic compound phase/Sn whisker/growth mechanism分类
矿业与冶金引用本文复制引用
林冰,黄琳,简玮,王江涌..界面热力学在Sn晶须生长研究中的应用[J].表面技术,2015,(2):1-7,18,8.基金项目
国家自然科学基金(11274218) Fund：Supported by the National Natural Science Foundation of China (11274218) （11274218）
