电子科技大学学报Issue(3)：471-474,4.DOI:10.3969/j.issn.1001-0548.2015.03.027
SnAgCu-nano Al钎料Anand本构关系及焊点可靠性
Anand Constitutive Relation of SnAgCu-nano Al and the Reliability of Solder Joints
摘要
Abstract
In this paper, the constitutive relation of SnAgCu-nano Al is investigated and the constitutive model is used in the finite element simulation to analyze the stress-strain response in FCBGA devices. The results show that the nine parameters of the Anand model can be fitted based on nonlinear data fitting method with different temperature and strain rate. Combining Anand model, the stress-strain response of solder joints is calculated by using the finite element method, and it is found that the distribution of stress-strain of solder joints in FCBGA device can be affected by the solder joints array, i.e., the maximum stress-strain concentrates in the concern solder joints. The results also demonstrate that the stress-strain of SnAgCu-nano Al solder joints is lower than that of SnAgCu solder joints, which implies that the addition of nano Al particles can enhance the reliability of SnAgCu solder joints.关键词
本构关系/无铅钎料/可靠性/应力-应变Key words
constitutive relation/lead-free solders/reliability/stress-strain分类
矿业与冶金引用本文复制引用
张亮,韩继光,郭永环,何成文..SnAgCu-nano Al钎料Anand本构关系及焊点可靠性[J].电子科技大学学报,2015,(3):471-474,4.基金项目
国家自然科学基金(51475220)；江苏省自然科学基金(BK201244) （51475220）
