| 注册
首页|期刊导航|电子器件|低互调同轴腔体合路器的设计∗

低互调同轴腔体合路器的设计∗

潘宁 叶强 孔博

电子器件Issue(2):240-244,5.
电子器件Issue(2):240-244,5.DOI:10.3969/j.issn.1005-9490.2015.02.003

低互调同轴腔体合路器的设计∗

Design of Lower Intermodulation Combiner Based on Coaxial Cavity

潘宁 1叶强 1孔博1

作者信息

  • 1. 中国计量学院信息工程学院,杭州310018
  • 折叠

摘要

Abstract

To meet the requirements of communication system for lower intermodulation,the contribution to passive intermodulation is analyzed and a dual-frequency ( CDMA800 and GSM900 ) combiner by using coaxial cavity de-signed . The coaxial cavity structure is presented using a method of circuit optimization simulation and full wave opti-mization simulation by simulation software Ansoft Designer and Ansoft Hfss. It is found that the measured result is consistent with the design after the combiner is manufactured and measured. So it has the very good application val-ue and prospect among the similar products.

关键词

合路器/低互调/仿真/优化/同轴腔体

Key words

combiner/lower passive intermodulation/simulation/optimization/coaxial cavity

分类

信息技术与安全科学

引用本文复制引用

潘宁,叶强,孔博..低互调同轴腔体合路器的设计∗[J].电子器件,2015,(2):240-244,5.

基金项目

杭州市重大科技创新项目(20112311A57) (20112311A57)

电子器件

OA北大核心CSTPCD

1005-9490

访问量0
|
下载量0
段落导航相关论文