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图像处理耦合机器视觉的芯片表面缺陷检测研究与应用

李如平 徐珍玉 吴房胜

湖北民族学院学报(自然科学版)Issue(2):210-214,5.
湖北民族学院学报(自然科学版)Issue(2):210-214,5.DOI:10.13501/j.cnki.42-1569/n.2015.06.024

图像处理耦合机器视觉的芯片表面缺陷检测研究与应用

Research and Application on the Chip Surface Defect Inspection Based on Image Processing and Machine Vision

李如平 1徐珍玉 2吴房胜1

作者信息

  • 1. 安徽工商职业学院电子信息系,安徽合肥231131
  • 2. 农业物联网技术集成与应用重点实验室,安徽合肥230088
  • 折叠

摘要

Abstract

In the microelectronics industry ,chip surface visual inspection requirements have been widely exist, while the traditional manual inspection methods are unable to correspond to the current require -ments of automation and digitization .The current application of image processing technology in electronic chip appearance inspection , but often does not have a set of system , just proposed algorithm or solutions to a problem.Therefore, this paper proposes a defective chip surface inspection system based on image processing and machine vision , and integrated implementation in software hardware .First build the cam-era, lens, light source such as hardware platform based on the image acquisition and image processing ;localization algorithm based on ROI chip area , defect identification .Finally ,introduced the IO card control drive servo , code reading device , recording chip ID based on Socket communication to complete the com-puterization of statistics , so as to improve the whole system .Finally,the mechanism of performance test , the results show that:compared with the manual method , this mechanism has higher efficiency and preci-sion.

关键词

机器视觉/ROI/芯片检测/Socket/图像处理

Key words

machine vision/ROI/chip detection/socket/image processing

分类

信息技术与安全科学

引用本文复制引用

李如平,徐珍玉,吴房胜..图像处理耦合机器视觉的芯片表面缺陷检测研究与应用[J].湖北民族学院学报(自然科学版),2015,(2):210-214,5.

基金项目

安徽省科技攻关计划项目(13011031029、1201a0301008);安徽省厅级自然科研项目(KJ2011B069、KJ2013Z105);安徽省对外科技合作计划项目(1403062028). ()

湖北民族学院学报(自然科学版)

2096-7594

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