集成技术Issue(6)：76-83,8.
电子封装基板材料研究进展及发展趋势
The Research Development and Trend of Substrates in Electronic Packages
摘要
Abstract
The main functions of substrates in electronic packaging include supporting, cooling, protection of semiconductor chips, as well as insulation and electronic interconnection with external chips. With the electronic packaging developing towards high speed, multi-functionalization, high performance, good stability and small dimension, substrates play more and more important role in the ifeld of new generation electronics packaging. Scientists and engineers have higher requirement to substrate materials, which advances their brilliant progress. In this review, the characteristic, recent progress and future development of three kinds of substrates were summerized, including ceramic, composite and organic substrates.关键词
电子封装/基板材料/陶瓷基板/复合材料基板/有机基板Key words
electronic packaging/substrate materials/ceramic substrate/composite substrate/organic substrate引用本文复制引用
曾小亮,孙蓉,于淑会,许建斌,汪正平..电子封装基板材料研究进展及发展趋势[J].集成技术,2014,(6):76-83,8.基金项目
广东省引进创新科研团队计划(2011D052)；深圳市孔雀计划团队(KYPT20121228160843692)；三维高密度基板及高性能CPU封装技术研发与产业化，国家02专项(2011ZX02709)；深圳市电子封装材料工程实验室(深发改【2012】372号) （2011D052）
