集成技术Issue(6)：111-119,9.
用于薄晶圆加工的临时键合胶
Temporary Adhesives for Thin Wafer Handling
摘要
Abstract
3D integrated circuits (3D-ICs) by stacking electronic devices can increase system capacity and functionality while decreasing the overall footprint. Through-silicon via (TSV) technology based on thin wafers (typically below 100 µm) has been developed to realize 3D-IC packaging over the last decades. Due to their fragileness and tendency of warping, thin device wafer needs to be bonded ifrmly to a carrier wafer during TSV processing and readily separated from the carrier after processing. The present research situation of temporary adhesive used in this processing was introduced in this paper, and the properties of a novel temporary adhesive based on thermoplastic resin were investigated systematically. This novel adhesive possesses excellent rheological properties, thermal stability, chemical resistance and sufifcient bonding strength, and convenient post-processing. These results extend the candidate polymers for temporary bonding materials and can ultimately promote the practical application of the TSV technology.关键词
临时键合胶/热塑性/热稳定性/薄晶圆Key words
temporary adhesive/thermoplastic/thermal stability/thin wafer分类
化学化工引用本文复制引用
帅行天,张国平,邓立波,孙蓉,李世玮,汪正平..用于薄晶圆加工的临时键合胶[J].集成技术,2014,(6):111-119,9.基金项目
国家自然科学基金(21201175)；广东省引进创新科研团队计划(2011D052)；深圳市孔雀计划团队(KYPT20121228160843692)；深圳市电子封装材料工程实验室(深发改【2012】372号) （21201175）
