金刚石与磨料磨具工程Issue(2)：57-61,5.DOI:10.13394/j.cnki.jgszz.2014.2.0013
金刚石线锯切割多晶硅表面形貌特征分析
Surface morphology characteristics analysis of diamond wire saw cutting polysilicon
张辽远 1吕忠秀 1王硕 1邵中青1
作者信息
- 1. 沈阳理工大学 机械工程学院，沈阳 110159
- 折叠
摘要
Abstract
In this test self-made test equipment is applied to carry on electroplated diamond wire saw cutting experiment of hard and brittle materials polysilicon and Japanese VHX-1000C ultra-precision three-dimensional microscopy system is used to study on polysilicon slice surface morphology Besides the influence of the workpiece speed pre-equipoise force and ultrasound on sawing surface roughness is analyzed The results show that the surface of polycrystalline silicon slice is mainly composed of long deep grooves shallow scratches a large amount of surface crushings and a small amount of large deep pits In addition with the increase of workpiece feed speed silicon wafer surface roughness values becomes larger while its balance force increase will make the silicon wafer surface roughness value smaller Applying ultrasonic vibration can significantly improve the processing efficiency reduce the silicon wafer surface roughness values.关键词
金刚石线锯/多晶硅/表面形貌/粗糙度Key words
diamond wire saw/polysilicon/surface morphology/roughness分类
矿业与冶金引用本文复制引用
张辽远,吕忠秀,王硕,邵中青..金刚石线锯切割多晶硅表面形貌特征分析[J].金刚石与磨料磨具工程,2014,(2):57-61,5.
