金刚石与磨料磨具工程Issue(1)：11-16,6.DOI:10.13394/j.cnki.jgszz.2015.1.0003
钛酸钡陶瓷基片的双面研抛加工研究
Double-sided lapping and polishing on BaTiO3 ceramic substrate
摘要
Abstract
BaTiO3 ceramic substrate was machined by double-sided lapping,and the influence of process parameters on the surface roughness (Ra) and material removal rate (MRR) were studied.Al2 O3 , whose particle size were W14,W7 and W5,were used to grind,pre-lap and lap BaTiO3 substrate at pressure of 3.26 kPa and rotation speed 37 r/min by double side lapping.The concentration of abrasive was 9% and grinding fluid flow was 10 mL/min.The substrate was ground from Ra 0.219μm to Ra 0.076 6μm.If ground with W0.2 SiO2 ,there would be an ultra-smooth surface of Ra 6 nm.The topography of the machined substrate surface was observed by laser confocal microscopy and SEM.The material removal mechanism was discussed.It was found that the fragile mode played a dominant role in the lapping process,while plastic removal mode played a dominant role in the polishing process.关键词
钛酸钡陶瓷/双面研磨/抛光/去除机理/表面粗糙度/表面形貌Key words
BaTiO3 ceramics/double-sided lapping/polishing/material removal mechanism/surface roughness/surface topography分类
矿业与冶金引用本文复制引用
李国明,阎秋生,潘继生..钛酸钡陶瓷基片的双面研抛加工研究[J].金刚石与磨料磨具工程,2015,(1):11-16,6.基金项目
国家自然科学基金资助项目(51305082) （51305082）
