机械与电子Issue(5)：33-35,3.
高温度环境下大功率 PCB 板的设计
Designof High Power PCB in High Temperature Environment
胡松涛 1付娟 1王振收 1李旺1
作者信息
- 1. 中国电子科技集团公司第 38 研究所，安徽 合肥 230031
- 折叠
摘要
Abstract
Multilayer PCB is used widely in e-lectrical plug and equipment.With the development of lightweight and high performance in electronic products,leading to more serious problems for board level radiation.In the high temperature envi-ronment,according to the previous extensive de-sign method cannot meet the design requirments. This paper mainly discusses the design method of large power PCB,puts forward a new thermal de-sign method of multilayer PCB.By theory calcula-tion and simulation analysis according to the power consumption of a printed circuit board device,ef-fectivelyreduce the printed circuit board level tem-perature,has good practicability,which makes the component derating design meet the requirements.关键词
印制板/热设计/热传导/高温度环境Key words
PCB/thermal design/heat conduc-tion/high temperature environment分类
信息技术与安全科学引用本文复制引用
胡松涛,付娟,王振收,李旺..高温度环境下大功率 PCB 板的设计[J].机械与电子,2015,(5):33-35,3.
