武汉工程大学学报Issue(11)：1-6,6.DOI:10.3969/j.issn.1674-2869.2014.011.001
电镀污泥中铜的浸出工艺及其动力学
Leaching process and kinetics of copper electroplating sludge
摘要
Abstract
The experiment was carried out for leaching copper from sludge of electroplating wastewater in a surface treatment industrial park using sulfuric acid as the leaching agent .The sludge was dried and grinded and it's main components were analyzed by using X‐ray diffraction and X‐ray energy spectrome‐ter .Result shows that the sludge contains 19 .03% copper .The effects of sulfuric acid concentration , solid‐to‐liquid ratio ,reaction time ,temperature and stirring speed on the leaching rate of copper were discussed .The results show that the leaching rate of copper is 97% under the conditions of sulfuric acid mass fraction of 20% ,solid‐to‐liquid ratio of 1:10 ,stirring speed of 700 r/min ,reaction time of 40 min and temperature of 20 ℃ .The kinetics of the copper‐leaching process was studied according to the un‐reaction shrinking core model .T he results indicate that the leaching rate of copper is mainly controlled by the solid membrane diffusion rate ,in w hich reaction order is 0 .828 2 and leaching activation energy is 11 .809 kJ/mol . T he study provides a theoretical basis for a safe disposal of copper electroplating sludge .关键词
电镀污泥/铜/硫酸/浸出工艺/动力学Key words
electroplating sludge/copper/sulfuric acid/leaching process/kinetics分类
资源环境引用本文复制引用
余训民,金虹,胡丽军,黄雯琦,王术智..电镀污泥中铜的浸出工艺及其动力学[J].武汉工程大学学报,2014,(11):1-6,6.基金项目
武汉工程大学研究生教育创新基金 （）
