现代电子技术Issue(12)：129-133,5.
智能移动终端产品热设计研究
Research on thermal design of smart phone terminal product
摘要
Abstract
In order to solve the local overheating problems existing in intelligent mobile terminal,starting from the plane layout area,the heat conduction technology is adopted to catch the key of heat source device layout for multimode intelligent mo-bile terminal. The minimum layout area,taking account of heat dissipation,was obtained. The height of the complete machine structure was calculated according to heat flux density. The layout and structure design were simulated through thermal simula-tion technology. A reference comment about structure design is givenb in this paper. The test is performed to verify and improve the thermal design. The heating infrared spectrum distribution test was applied to an actual product. The temperature distribution plan of intelligent mobile products was obtained. A conclusion which was in keeping with simulation was obtained.关键词
智能终端/热仿真/热设计/热流密度/热源器件Key words
smart terminal/thermal simulation/thermal design/thermal density/thermal source component分类
信息技术与安全科学引用本文复制引用
张宏伟,毛建华..智能移动终端产品热设计研究[J].现代电子技术,2014,(12):129-133,5.基金项目
国家重大科研科技项目TD-LTE及TD-LTE-Advance终端一致性规范研究(2012ZX03001040) （2012ZX03001040）
