现代电子技术Issue(6)：39-40,43,3.
超厚铝基板焊接工艺研究
Research on welding technology for super thick aluminum substrate
谭小鹏1
作者信息
- 1. 中国电子科技集团 第二十研究所，陕西 西安 710068
- 折叠
摘要
Abstract
The super thick aluminum substrate is a kind of special printed⁃circuit board,which has good performance in size stability and heat conduction,and has been gradually used in the fields of military equipment and high⁃tech civil product, but its good heat conduction brought about difficulty of welding. It means that the manual welding under the limitation of electric iron temperature (280~320℃) prescribed by the military standard,is unable to complete the welding. A new type of heating mode is adopted in the welding process to compensate heat loss of aluminum substrate,find the best process parameters by means of technological test,and solve the welding problem.关键词
铝基板/预热板/手工焊接/热补偿Key words
aluminum substrate/preheat equipment/manual soldering/thermal compensation分类
信息技术与安全科学引用本文复制引用
谭小鹏..超厚铝基板焊接工艺研究[J].现代电子技术,2015,(6):39-40,43,3.
