现代电子技术Issue(13)：137-140,144,5.
高速大容量存储电路板的信号性能分析研究
Study on signal performance analysis of high-speed transferring and large-capacity memory circuit board
摘要
Abstract
Since the topology of PCB design generates signal integrity problem in high⁃speed transferring circuit,on the ba⁃sis of interconnection of TI8168 chip and high⁃speed multi⁃chip DDR3,wire arrangement principle and signal integrity theory of high⁃speed transferring circuit board are studied by analyzing the bus topology in high⁃speed transferring circuit board. Signal reflection control method and the combined topology of T⁃type and Fly⁃by are proposed. The topology is simulated by using SigXplorer software in Cadence. Simulation results show that the topology can solve signal delay in receiving terminal and actual wire ar⁃rangement difficulty in Fly⁃by topology,and optimize the complex problem of terminal joint in multi⁃chip DDR3 receiving terminal in T⁃type topology. Signal delay and reflection are eliminated effectively,and signal integrity is ensured.关键词
信号完整性/拓扑结构/信号反射/端接/时延Key words
signal integrity/topology/signal reflection/terminal joint/time delay分类
信息技术与安全科学引用本文复制引用
侯斌,杨祎,巩稼民..高速大容量存储电路板的信号性能分析研究[J].现代电子技术,2015,(13):137-140,144,5.基金项目
国家高技术研究发展计划（863计划）课题项目（2013AA014504）；西安邮电大学2013年研究生创新基金资助项目 （）
