现代电子技术Issue(15)：63-65,3.
一种用于X波段T/R组件的小型化高平坦度耦合器设计
Design of miniaturization high flatness coupler applied to X-wave-band T/R assembly
刘建勇 1陈兴国 1王光池1
作者信息
- 1. 中国电子科技集团公司 第三十八研究所，安徽 合肥 230088
- 折叠
摘要
Abstract
To satisfy the requirements of calibration and correction for X⁃wave⁃band T/R assembly,in which small⁃size and high performance coupler should be integrated. In weak coupling condition,the microstrip⁃to⁃stripline multi⁃order hole⁃coupler has the advantages of flat coupling characteristic,small size and easy to integrate with radio frequency active circuits. This cou⁃pler is convenient to realize on LTCC multi⁃layer basic⁃plate of T/R assembly. In design process,firstly the number of the holes and their distribution features are determined according to the hole⁃coupling basic theory and formula. Then in combination with the restriction of actual layout,the parameterized model is established in the electromagnetic field simulation software HFSS. Finally the optimal physical parameter can be acquired by tuning and optimization in HFSS. The simulation results indicate that the coupler′ dimension is less than λ0 4, and the flatness in band is better than ±0.1 dB. This coupler has reached the design requirements,and can be widely used in X⁃wave⁃band miniaturization T/R assembly.关键词
X波段/小型化耦合器/小孔耦合/高平坦度Key words
X-wave-band/miniaturization coupler/hole-coupling/high flatness分类
信息技术与安全科学引用本文复制引用
刘建勇,陈兴国,王光池..一种用于X波段T/R组件的小型化高平坦度耦合器设计[J].现代电子技术,2015,(15):63-65,3.
