西南交通大学学报Issue(5)：869-874,6.DOI:10.3969/j.issn.0258-2724.2014.05.020
树脂基复合材料修补片固化过程中的温度场
Analysis of Temperature Field of Resin Matrix Composite Patches during Curing Process
摘要
Abstract
In order to optimize the curing parameter of resin matrix composite patches,a physical model and a mathematical model for composite laminate patches during thermal curing process were established by finite element method. Based on these models,numerical simulations were made to study the variation rules of temperature and curing degree during the curing process of the composite prepreg patches. The internal temperature distributions in prepreg repair patches were analyzed for different curing stages,and the curing processes at different points inside the patches were compared. The influences of heating rate,the patch thickness,and patch shape on the temperature and curing degree during curing process were also studied. The simulation results show that a faster heating rate can shorten the time for completing the curing process,and result in a higher temperature gradient within the patch;a more thick patch needs a shorter curing time and has a lower internal temperature gradient;and,the effect of the patch shape on the temperature and curing degree can be ignored for the non-penetrating repair.关键词
有限单元法/复合材料/修补片/固化过程/温度Key words
finite element method/composite/patch/curing process/temperature分类
通用工业技术引用本文复制引用
陈淑仙,王渊涛,杨文锋,李梦,秦文峰,唐庆如..树脂基复合材料修补片固化过程中的温度场[J].西南交通大学学报,2014,(5):869-874,6.基金项目
国家自然科学基金民航联合基金重点资助项目（U1233202，U1333201）；国家自然科学基金资助项目（51306201）；江苏省航空动力系统重点实验室开放课题资助项目 （）
