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Study on Temperature Distribution of Specimens Tested on the Gleeble 3800 at Hot Forming Conditions

Tao Gao Long Ma Xiao-Guo Peng

电子科技学刊Issue(4)：419-423,5.

电子科技学刊Issue(4)：419-423,5.DOI:10.3969/j.issn.1674-862X.2014.04.015

Study on Temperature Distribution of Specimens Tested on the Gleeble 3800 at Hot Forming Conditions

Tao Gao ¹Long Ma ¹Xiao-Guo Peng¹

作者信息

1. School of Mechanical, Electronic and Industrial Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
折叠

摘要

关键词

Coupled thermal-electrical simulation/hot forming/thermo-mechanical testing/temperature distribution

Key words

Coupled thermal-electrical simulation/hot forming/thermo-mechanical testing/temperature distribution

引用本文复制引用

Tao Gao,Long Ma,Xiao-Guo Peng..Study on Temperature Distribution of Specimens Tested on the Gleeble 3800 at Hot Forming Conditions[J].电子科技学刊,2014,(4):419-423,5.

基金项目

This work was supported by the Fundamental Research Funds for the Central Universities of China under Grant No. A03007023801073 （）

电子科技学刊

OACSCD

ISSN：1674-862X

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