中国机械工程Issue(9)：1175-1179,1238,6.DOI:10.3969/j.issn.1004-132X.2014.09.008
脉冲磁场辅助磁性复合磨粒化学机械抛光技术及其加工试验研究
Pulse Electromagnetic Field-assisted Chemical Mechanical Polishing Utilizing Magnetic Composite Abrasives Slurry and Its Polishing Performance
摘要
Abstract
A polishing method assisted by an auxiliary pulse electromagnetic field was proposed, where the magnetic polymer microspheres/SiO2 composite abrasives were anchored on a smooth glass tool plate by the magnetic force,and the dependence between diameter of composite abrasives and morphology of tool plate was reduced.In polishing processes,the abrasives entered into the polishing area easily by mean of pulse electromagnetic force,and a high material removal rate was obtained.An electromagnet with contrapuntal structure was designed,and simulation calculations show that uni-form distributions of magnetic flux density and electromagnetic force are achieved.Force analyses in-dicate that the electromagnetic force can help the magnetic polymer microspheres enter the polishing area from near-polishing area,and material is polished by magnetic composite abrasives in two-body abrasion wear mechanism.Owing to the pulse electromagnetic force,magnetic composite abrasives is deposited and entered into polishing area easily without the occurrence of magnetic abrasives aggrega-tion.Experiments of polishing silica wafer,using a glass tool plate of Ra 1.1μm surface roughness and pulse electromagnetic field with a certain frequency and duty cycle,have shown the superior char-acteristics.The material removal rate is increased from 137 nm/min to 288 nm/min with the assis-tance of the electromagnetic field of 5 Hz frequency and 50% duty cycle,and the surface roughness of wafer is decreased from Ra 405 nm to Ra 0.641 nm.关键词
化学机械抛光/脉冲磁场/磁性复合磨粒/材料去除率/硅片Key words
chemical mechanical polishing/pulse magnetic field/magnetic composite abrasives/material removal rate/silicon wafer分类
通用工业技术引用本文复制引用
黄亦申,赵彬善,黄水泉,游红武,许雪峰..脉冲磁场辅助磁性复合磨粒化学机械抛光技术及其加工试验研究[J].中国机械工程,2014,(9):1175-1179,1238,6.基金项目
浙江省自然科学基金资助重点项目(Z1080625) （Z1080625）
