中国机械工程Issue(16)：2231-2234,2239,5.DOI:10.3969/j.issn.1004-132X.2014.16.017
带有凸凹微结构的微流控基片热压成形特性研究
Research on Hot Embossing Process of Microfluidic Substrates with Both Convex and Concave Microstructures
摘要
Abstract
Hot embossing process of the devices with both concave microchannel and convex micro energy director for ultrasonic bonding was researched.Based on the constitutive relation and tempera-ture-depending mechanical properties of the material,commercial software was redeveloped.FEM was employed to simulate the embossing processes with different embossing temperatures.The influences of temperature and holding time on replication accuracy was analyzed with strictly defined embossing force.And the processing parameters were optimized.A silicon mold fabricated by multi-step lithog-raphy technology and two times of wet-etching processes was used in the hot embossing experiment. The experiments agree well with the simulation results.关键词
微流控芯片/超声波键合/导能筋/有限元法Key words
microfluidic chip/ultrasonic bonding/energy director/finite element method(FEM)分类
矿业与冶金引用本文复制引用
张宗波,吴宝贵,贺庆强,罗怡,王晓东,王立鼎..带有凸凹微结构的微流控基片热压成形特性研究[J].中国机械工程,2014,(16):2231-2234,2239,5.基金项目
国家自然科学基金资助项目(51205414) （51205414）
辽宁省微纳米技术及系统重点实验室开放基金资助项目(20110301) （20110301）
中央高校基本科研业务费专项资金资助项目(14CX02070A,12CX04062A) （14CX02070A,12CX04062A）
山东省中青年科学家奖励基金资助项目(BS2011ZZ020) （BS2011ZZ020）
