表面技术Issue(9)：23-28,6.DOI:10.16490/j.cnki.issn.1001-3660.2015.09.005
钼合金磁控溅射镀镍薄膜工艺及后续热处理
Plating Nickel Film on Molybdenum Alloy by Magnetron Sputtering and Follow-up Heat Treatment
摘要
Abstract
Objective To optimize the process of plating nickel film on molybdenum disc substrates by direct current magnetron sputtering, and research the follow-up heat treatment. Methods Though designing an orthogonal experiment scheme, the effects of sputtering power, sputtering pressure, bias voltage and deposition time on deposition rate and adhesion of nickel film were re-searched. The organization and structure of nickel film prepared with the optimal parameters were characterized by scanning elec-tron microscope and flatness tester. And the effect of follow-up heat treatment on adhesion of nickel film was also researched. Results The results showed that the primary and secondary order of the effects of the parameters on the deposition rate was:sputte-ring power, sputtering pressure and then bias voltage. The primary and secondary order of the effects of the parameters on the adhe-sion was:bias voltage, deposition rate, sputtering power, and then sputtering pressure. With increasing sputtering power, the dep-osition rate increased and the film adhesion increased at first and then decreased. With increasing deposition time, the deposition rate and film adhesion both increased at first and then decreased. Negative bias had little effect on the deposition rate, but it was beneficial for improving the adhesion of the film. And the film adhesion decreased with the increase of deposition time. The follow-up heat treatment of 1 h incubation at 850 ℃ in hydrogen atmosphere could obviously increase the film adhesion by promoting the formation of the diffusion layer. Conclusion The optimal process parameters of plating nickel film were:sputtering power 1. 8 kW, sputtering pressure 0. 3 Pa, bias voltage 450 V,deposition time 10 min. The thickness of th film was about 1. 15μm. The film and substrate bounded tightly, and the surface of film was smooth, continuous and dense. The follow-up heat treatment was an effective method to improve the adhesion of nickel film.关键词
磁控溅射/镍薄膜/沉积速率/附着力/热处理Key words
magnetron sputtering/nickel film/deposition rate/adhesion/heat treatment分类
矿业与冶金引用本文复制引用
洪波,潘应君,张恒,张扬..钼合金磁控溅射镀镍薄膜工艺及后续热处理[J].表面技术,2015,(9):23-28,6.
