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Packaging investigation of optoelectronic devices

Zhang Zhike Liu Yu Liu Jianguo Zhu Ninghua

半导体学报（英文版）2015，Vol.36Issue(10)：1-6,6.

半导体学报（英文版）2015，Vol.36Issue(10)：1-6,6.DOI:10.1088/1674-4926/36/10/101001

Packaging investigation of optoelectronic devices

Zhang Zhike ¹Liu Yu ¹Liu Jianguo ¹Zhu Ninghua¹

作者信息

1. State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences,Beijing 100083, China
折叠

摘要

关键词

optoelectronic packaging/PIC/butterfly packaging

Key words

optoelectronic packaging/PIC/butterfly packaging

引用本文复制引用

Zhang Zhike,Liu Yu,Liu Jianguo,Zhu Ninghua..Packaging investigation of optoelectronic devices[J].半导体学报（英文版）,2015,36(10):1-6,6.

基金项目

Project supported by the National High Technology Research and Development Program of China (Nos.2013AA014201, 2013AA014203)and the National Natural Science Foundation of China (Nos.61177080, 61335004, 61275031). （Nos.2013AA014201, 2013AA014203）

半导体学报（英文版）

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ISSN：1674-4926

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