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Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics

Jing Hongqi Zhong Li Ni Yuxi Zhang Junjie Liu Suping Ma Xiaoyu

半导体学报（英文版）2015，Vol.36Issue(10)：33-38,6.

半导体学报（英文版）2015，Vol.36Issue(10)：33-38,6.DOI:10.1088/1674-4926/36/10/102006

Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics

Jing Hongqi ¹Zhong Li ¹Ni Yuxi ¹Zhang Junjie ¹Liu Suping ¹Ma Xiaoyu¹

作者信息

1. National Engineering Research Center for Optoelectronic Devices, Institute of Semiconductors, Chinese Academy of Sciences,Beijing 100083, China
折叠

摘要

关键词

heat-sink/thermal simulation/flow velocity/temperature

Key words

heat-sink/thermal simulation/flow velocity/temperature

引用本文复制引用

Jing Hongqi,Zhong Li,Ni Yuxi,Zhang Junjie,Liu Suping,Ma Xiaoyu..Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics[J].半导体学报（英文版）,2015,36(10):33-38,6.

基金项目

Project supported by the Defense Industrial Technology Development Program (No.B1320133033). （No.B1320133033）

半导体学报（英文版）

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ISSN：1674-4926

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