红外技术Issue(4)：195-201,222,8.
向数字化发展的红外焦平面列阵
Toward Digitization in Infrared Focal Plane Array
王忆锋 1陆剑鸣1
作者信息
- 1. 昆明物理研究所，云南 昆明 650223
- 折叠
摘要
Abstract
Over the past several years, significant advances in infrared focal plane array(FPA)development have been achieved. Latest developments have been focused on the silicon readout integrated circuit (ROIC). Increasing of frame rate, new types of signal processing functions are an important progress in this field. A FPA with a digital signal output has attracted a lot of attention due to its advantages over detectors with analog signal outputs. The realization of analog to digital converter(ADC)on chip is the base of digital FPA. There are three on-chip ADC architectures, i.e., chip-level ADC, column-level ADC and pixel-level ADC. Mainly by summarizing and analyzing of some related references published in English, the status and trends of digital FPA were presented in this paper.关键词
数字化FPA/读出集成电路/红外成像系统/模数转换器Key words
digital FPA/readout integrated circuit/infrared imaging system/analog-to-digital converter分类
信息技术与安全科学引用本文复制引用
王忆锋,陆剑鸣..向数字化发展的红外焦平面列阵[J].红外技术,2013,(4):195-201,222,8.
