中国电机工程学报2015，Vol.35Issue(20)：5293-5300,后插17,9.DOI:10.13334/j.0258-8013.pcsee.2015.20.022
老化试验条件下的IGBT失效机理分析
Analysis of IGBT Failure Mechanism Based on Ageing Experiments
摘要
Abstract
Failure mechanism of IGBT modules is the foundation of the reliability condition of monitoring for converters. By analyzing the ageing failure mechanism of modules, the Ucecompensation model and Tjcomputing model were obtained, and the power cycle experiment rig was established for IGBT modules. Firstly, the physical process and failure mechanism of IGBT were validated and the electrical and thermal parameters were obtained. In addition, according to the experimental data the model of thermal resistor degradation were found. Finally the effects on power modules were analyzed under different test conditions. It is indicated that the solder fatigue is the main failure of the module during junction temperature cycling and the ageing velocity is proportional to the temperature difference. Therefore, according to the experimental data, the mechanism of ageing was discussed and analyzed which could make the foundation for the development of condition monitoring and the design of power device reliability.关键词
IGBT老化/失效机理/功率循环/结温计算/热阻监测Key words
IGBT ageing/IGBT failure/power cycle/junction temperature computing/thermal monitoring分类
信息技术与安全科学引用本文复制引用
赖伟,陈民铀,冉立,王学梅,徐盛友..老化试验条件下的IGBT失效机理分析[J].中国电机工程学报,2015,35(20):5293-5300,后插17,9.基金项目
国家自然科学基金项目(51477019) （51477019）
中央高校基本科研业务费专项资金资助(CDJZR12150074) （CDJZR12150074）
国家重点基础研究发展计划项目(973项目)(2012CB25200). Project Supported by National Natural Science Foundation of China (51477019) （973项目）
Fundamental Research Funds for the Central Universities(CDJZR12150074) （CDJZR12150074）
The National Basic Research Program of China (973 Program) (2012CB25200). （973 Program）
