工程科学学报2015，Vol.37Issue(12)：1601-1609,9.DOI:10.13374/j.issn2095-9389.2015.12.011
盐雾对喷锡和化金印制电路板腐蚀行为的影响
Effect of salt spray environment on the corrosion behavior of PCB--HASL and PCB--ENIG
摘要
Abstract
The corrosion behavior of hot air solder level printed circuit boards ( PCB- HASL) and electroless nickel immersion gold printed circuit boards ( PCB- ENIG) in salt spray test was studied by electrochemical impedance spectroscopy. The corrosion product morphology, composition and coating failure mechanism were observed by stereo microscopy, scanning electron microscopy and energy-dispersive X-ray spectroscopy. The results show that PCB-HASL and PCB-ENIG suffer severe corrosion in high salt spray en-vironment. Localized corrosion occurs first in the Sn plating layer, and then almost entire surface corrosion occurs, similar to uniform corrosion. PCB-ENIG mainly generates microporous corrosion. In the PCB- HASL corrosion process, Cl- promotes the corrosion of the Sn layer, then a large amount of corrosion product gradually forms and covers the Sn surface, it makes the corrosion rate reduce. In the PCB-ENIG corrosion process, a thin liquid layer containing Cl- electrolyte forms in micropores, and galvanic coupling between gold and nickel constitutes, which accelerates Ni corrosion. The Cu base directly exposes in the adverse environment after Ni suffers serious corrosion, finally leading to electronic component failure.关键词
印制电路板/盐雾实验/腐蚀/失效Key words
printed circuit boards/salt spray test/corrosion/failure分类
金属材料引用本文复制引用
易盼,丁康康,宋维锋,董超芳,李晓刚,吴俊升,肖葵..盐雾对喷锡和化金印制电路板腐蚀行为的影响[J].工程科学学报,2015,37(12):1601-1609,9.基金项目
国家自然科学基金资助项目(51271032) （51271032）
