红外技术Issue(12)：1016-1021,6.
具有TDMI功能的640×512双色碲镉汞焦平面读出电路
The ROIC for 640×512 Dual Band MCT Focal Plane Arrays with TDMI Operation
摘要
Abstract
The 640×512 ROIC used for one-indium-bump dual band MCT stacked focal plane array was developed. Four kinds of operation, LWIR only integration, MWIR only operation, DWIR Sequential integration and DWIR time-division multiplexed integration, were designed for one-indium-bump dual band MCT stacked focal plane array. The pixel input cell circuit was designed with LW integration DI circuit and MW integration DI circuit, the LW signal and MW signal were transported separately. To improve adaptability of the dual band detector assembly, the anti-booming operation had been achieved. The ROIC supports dual band signal Snapshot module,integration then readout (ITR) or integration while readout (IWR) operation separately, and selectable window readout modes. The 640×512 dual band focal plane ROIC was fabricated in 0.35mm DPFM CMOS process. The test result shows that the ROIC has good performance. The dynamic range of the ROIC is 2.3V, the time-division multiplexed integration operated well, and the total power dissipation is about 65mW.关键词
长/中波双色焦平面/单铟柱双色叠层结构/双色读出电路/时分多路积分Key words
long/middle wave dual band focal plane array/dual band read out integrated circuit/time-division multiplexed integration/one-indium-bump dual band MCT stacked分类
信息技术与安全科学引用本文复制引用
白丕绩,李敏,王博,陈虓,梁艳,洪建堂,李立华..具有TDMI功能的640×512双色碲镉汞焦平面读出电路[J].红外技术,2015,(12):1016-1021,6.基金项目
国防预研基金。 （）
