电机与控制应用2016，Vol.43Issue(1)：22-28,7.
IGBT热模型的硬件在环实时仿真方法研究
Research on Hardware-in-the-Loop Real-time Simulation Method of IGBT Thermal Model
摘要
Abstract
Based on the existing ideal Hardware-in-the-loop ( HIL) real-time simulation model of voltage source type three-phase bridge type inverter, the HIL real-time simulation model of IGBT loss and temperature rise was established. The model was set up on the HIL platform based on field programmable gate array ( FPGA) . Using data sheet with linear interpolation method, IGBT loss model was established. By adopting the method of equivalent thermal network circuit, IGBT temperature model was established. Also according to the structural parameters of radiator, the thermal resistance was calculated to enhance the applicability of the model. In order to extend the practical value of model, the PC communication design using LabVIEW was carried on, realizing real-time input function of the model parameters and the function of model data real-time acquisition and transmission to the PC interface to display. At the end, the real-time HIL simulation model was compared with the MATLAB simulation model to validate the data accuracy of the model, and compared with actual test to verify the reliability of the model.关键词
IGBT损耗及温升/现场可编程门阵列/硬件在环Key words
IGBT loss and temperature rise/field programmable gate array ( FPGA)/hardware-in-the-loop ( HIL)分类
信息技术与安全科学引用本文复制引用
高瑾,霍锋伟,殷桂来,黄苏融..IGBT热模型的硬件在环实时仿真方法研究[J].电机与控制应用,2016,43(1):22-28,7.基金项目
国家863高技术基金项目(2012AA110802) （2012AA110802）
