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Electrical Characterization of the through Via in Package-on-Package with Interposer using Parameter Extraction Method

Young-Min Yoon No-Su Kim Eun-Hyuk Kuak Jae-Kyung Wee Boo-Gyoun Kim

测试科学与仪器：英文版Issue(S1)：P.160-163,4.

Electrical Characterization of the through Via in Package-on-Package with Interposer using Parameter Extraction Method

Young-Min Yoon ¹No-Su Kim ¹Eun-Hyuk Kuak ¹Jae-Kyung Wee ¹Boo-Gyoun Kim¹

作者信息

1. School of Electronic Engineering,Soongsil University
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摘要

关键词

parameter extraction/de-embedding/ Package-on-Package(PoP)

分类

信息技术与安全科学

引用本文复制引用

Young-Min Yoon,No-Su Kim,Eun-Hyuk Kuak,Jae-Kyung Wee,Boo-Gyoun Kim..Electrical Characterization of the through Via in Package-on-Package with Interposer using Parameter Extraction Method[J].测试科学与仪器：英文版,2010,(S1):P.160-163,4.

基金项目

supported by KEIT(0802DD-2007) （0802DD-2007）

funded by MKE(Ministry of Knowledge Economy) （Ministry of Knowledge Economy）

测试科学与仪器：英文版

ISSN：1674-8042

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