首页|期刊导航|测试科学与仪器：英文版|Electrical Characterization of the through Via in Package-on-Package with Interposer using Parameter Extraction Method
Electrical Characterization of the through Via in Package-on-Package with Interposer using Parameter Extraction MethodOA
This paper describes a method to extract electrical parameters of the through via in Package-on-Package(PoP)with interposer.Using the de-embedding technique electrical parameters of the through via are extracted.With th…查看全部>>
Young-Min Yoon;No-Su Kim;Eun-Hyuk Kuak;Jae-Kyung Wee;Boo-Gyoun Kim
School of Electronic Engineering,Soongsil UniversitySchool of Electronic Engineering,Soongsil UniversitySchool of Electronic Engineering,Soongsil UniversitySchool of Electronic Engineering,Soongsil UniversitySchool of Electronic Engineering,Soongsil University
动力与电气工程
parameter extractionde-embedding Package-on-Package(PoP)
《测试科学与仪器：英文版》 2010 (S1)
P.160-163,4
supported by KEIT(0802DD-2007)funded by MKE(Ministry of Knowledge Economy)
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