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Optimal design analysis for thermal performance of high power 2.5D package

Liu Xiaoyang Ma He Yu Daquan Chen Wenlu Wu Xiaolong

半导体学报（英文版）2016，Vol.37Issue(3)：110-114,5.

半导体学报（英文版）2016，Vol.37Issue(3)：110-114,5.DOI:10.1088/1674-4926/37/3/035006

Optimal design analysis for thermal performance of high power 2.5D package

Liu Xiaoyang ¹Ma He ¹Yu Daquan ¹Chen Wenlu ¹Wu Xiaolong¹

作者信息

1. Jiangnan Institute of Computing Technology, Institute of Microelectronics, Chinese Academy of Sciences,Beijing 100029, China
折叠

摘要

关键词

2.5D package/high power/thermal design/ANSYS

Key words

2.5D package/high power/thermal design/ANSYS

引用本文复制引用

Liu Xiaoyang,Ma He,Yu Daquan,Chen Wenlu,Wu Xiaolong..Optimal design analysis for thermal performance of high power 2.5D package[J].半导体学报（英文版）,2016,37(3):110-114,5.

基金项目

Project supported by the National S & T Major Projects (No.2011ZX02709-2) and the China National Science Foundation (No.61176098). （No.2011ZX02709-2）

半导体学报（英文版）

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ISSN：1674-4926

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