首页|期刊导航|半导体学报（英文版）|Effect of polishing parameters on abrasive free chemical mechanical planarization of semi-polar (11-22) aluminum nitride surface
半导体学报（英文版）2016，Vol.37Issue(3)：115-121,7.DOI:10.1088/1674-4926/37/3/036001
Effect of polishing parameters on abrasive free chemical mechanical planarization of semi-polar (11-22) aluminum nitride surface
Effect of polishing parameters on abrasive free chemical mechanical planarization of semi-polar (11-22) aluminum nitride surface
摘要
关键词
AlN/AFCMP/chemical mechanical planarization/material removal rate/surface roughnessKey words
AlN/AFCMP/chemical mechanical planarization/material removal rate/surface roughness引用本文复制引用
Khushnuma Asghar,D.Das..Effect of polishing parameters on abrasive free chemical mechanical planarization of semi-polar (11-22) aluminum nitride surface[J].半导体学报（英文版）,2016,37(3):115-121,7.基金项目
Authors greatly acknowledge the financial support from the Department of Science and Technology (DST),Government of India (No,SR/S2/Cmp-0009/2011),and partial support from the Board of Research in Nuclear Sciences (BRNS),Department of Atomic Energy (DAE),Government of India (No.-34/14/43/2014-BRNS) with ATC,BRNS is gratefully acknowledged. （DST）
