东华大学学报（英文版）2015，Vol.32Issue(6)：1060-1062,3.
Random Vibration Analysis of Electronic Equipment Based on the Substructure Method
Random Vibration Analysis of Electronic Equipment Based on the Substructure Method
CHAI Guo-dong 1WANG Shun-hui2
作者信息
- 1. College of Applied Technology, Southwest Petroleum University, Nanchong 637001, China
- 2. College of Chemistry and Chemical Engineering, Southwest Petroleum University, Chengdu 610500, China
- 折叠
摘要
关键词
finite element analysis (FEA)/substructure/random vibration analysis/electronic chassisKey words
finite element analysis (FEA)/substructure/random vibration analysis/electronic chassis分类
机械制造引用本文复制引用
CHAI Guo-dong,WANG Shun-hui..Random Vibration Analysis of Electronic Equipment Based on the Substructure Method[J].东华大学学报（英文版）,2015,32(6):1060-1062,3.
