中国机械工程2016，Vol.27Issue(6)：721-726,6.DOI:10.3969/j.issn.1004-132X.2016.06.003
纳米尺度单晶铜材料表面切削特性分子动力学模拟
Molecular Dynamics Simulation of Single Crystal Copper Material Surface Cutting Properties in Nano-scale
摘要
Abstract
The surface cutting properties of single crystal copper material were researched by using molecular dynamics simulation.Through molecular dynamics modeling,calculation and analysis,the influences of different cutting speeds or cutting thicknesses on single crystal copper surface nano-cut-ting process microscopic atomic states and the change rule of contact area cutting force were studied. The results show that the accumulated volume of chips increases with the cutting speed increases in nano-cutting process of single crystal copper surface,at the same time the atoms in the chip stack are tighter and the distribution of dislocation defects is wider.The accumulated volume of chips in front of tool and the dislocation defects increase with the cutting thickness increases in a same cutting speed.In different cutting speeds or cutting thicknesses,the cutting force will rise at first,and float around a stable value after reaching a steady stage.During initial stage of cutting,the higher the cutting speed or cutting thickness,the larger rise range of cutting force.After reaching the steady stage of cutting, the higher the cutting speed or cutting thickness,the larger cutting force.关键词
单晶铜/切削性能/纳米切削/分子动力学Key words
single crystal copper/cutting property/nano-cutting/molecular dynamics分类
矿业与冶金引用本文复制引用
李勇,杨晓京..纳米尺度单晶铜材料表面切削特性分子动力学模拟[J].中国机械工程,2016,27(6):721-726,6.基金项目
国家自然科学基金资助项目(51365021) （51365021）
