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Design, analysis and test of high-frequency interconnections in 2.5D package with silicon interposer

Ren Xiaoli Pang Cheng Qin Zheng Ping Ye Jiang Feng Xue Kai Liu Haiyan

半导体学报（英文版）2016，Vol.37Issue(4)：113-119,7.

半导体学报（英文版）2016，Vol.37Issue(4)：113-119,7.DOI:10.1088/1674-4926/37/4/045003

Design, analysis and test of high-frequency interconnections in 2.5D package with silicon interposer

Ren Xiaoli ¹Pang Cheng ¹Qin Zheng ²Ping Ye ¹Jiang Feng ²Xue Kai ¹Liu Haiyan²

作者信息

1. National Center for Advanced Packaging(NCAP China), Wuxi 214315, China
2. Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China
折叠

摘要

关键词

interposer/TSV (through-silicon vias)/RDL/high-frequency simulation/test/S-parameter

Key words

interposer/TSV (through-silicon vias)/RDL/high-frequency simulation/test/S-parameter

引用本文复制引用

Ren Xiaoli,Pang Cheng,Qin Zheng,Ping Ye,Jiang Feng,Xue Kai,Liu Haiyan..Design, analysis and test of high-frequency interconnections in 2.5D package with silicon interposer[J].半导体学报（英文版）,2016,37(4):113-119,7.

基金项目

Project supported by the National S&T Major Projects (No.2011ZX02709) and the National Natural Science Foundation of China (No.61176098). （No.2011ZX02709）

半导体学报（英文版）

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ISSN：1674-4926

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