红外技术2016，Vol.38Issue(4)：310-314,5.
铟凸点对倒装互连影响的研究
Dissecting the Influence of Indium Bumps for Flip-chip
杨超伟 1俞见云 1闫常善 2王琼芳 1李京辉 1韩福忠 1封远庆 1杨毕春 1左大凡 1赵丽1
作者信息
- 1. 昆明物理研究所,云南昆明 650223
- 2. 中国人民解放军驻298厂军代室,云南昆明 650114
- 折叠
摘要
Abstract
Two types of indium bumps have been fabricated: indium columns fabricated by direct evaporation and indium balls after reflowing indium columns. The impacts of indium columns and indium balls on flip-chip were discussed, and in particular the shear strength of indium columns and indium spheres was tested after flip-chip. Results reveal that the shear strength of indium spheres is 1.5 times higher than that of the indium columns without reflowing after flip-chip, and 2.8 times higher than that of the indium columns with reflow after flip-chip, respectively. In addition, the effects resulted from indium spheres which were exposed in the air for a long time for flip-chip were dissected. Results unravel that the indium spheres have negative influences on the electrical and mechanical connectivity of devices after flip-chip.关键词
铟凸点/铟柱/铟球/倒装互连Key words
indium bump/indium column/indium ball/flip-chip分类
信息技术与安全科学引用本文复制引用
杨超伟,俞见云,闫常善,王琼芳,李京辉,韩福忠,封远庆,杨毕春,左大凡,赵丽..铟凸点对倒装互连影响的研究[J].红外技术,2016,38(4):310-314,5.
