现代电子技术2016，Vol.39Issue(7)：138-141,4.DOI:10.16652/j.issn.1004-373x.2016.07.034
多排阵列大功率LED的ICEPAK热分析
ICEPAK-based thermal analysis for multi-row array high-power LED
摘要
Abstract
The LED lighting lamps release great heat while working due to its small size and large power,which affects on the luminous efficiency and service life,so the heat dissipation problem is a thorny issue of LED lighting lamps all the time. The heat dissipation problem of high⁃power LED lighting lamps is discussed with thermal analysis software ANSYS Icepak. The temperature,velocity and pressure distribution in the model,and temperature and pressure contours of the substrate are dis⁃cussed by means of numerical simulation. When the original fan flow rate is 0.005 kg/s,fin thickness is 0.018 m and fin row⁃space is 0.014 m,the highest temperature of LED′s key element substrate is about 81.30 ℃. The temperature,pressure and velocity contours of the fans center section,as well as the temperature,pressure and velocity change curves of the center line along y direction are obtained,which reflect the heat dissipation situation of the multi⁃row array high⁃power LED while working.关键词
LED照明灯具/多排阵列/Icepak/数值模拟/热分析Key words
LED lighting lamp/multi-row array/Icepak/numerical simulation/thermal analysis分类
信息技术与安全科学引用本文复制引用
王明霞,周俊杰..多排阵列大功率LED的ICEPAK热分析[J].现代电子技术,2016,39(7):138-141,4.基金项目
国家自然科学基金 （）
