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基于低温共烧陶瓷的微机械差分电容式加速度计的研究

张义川 缪旻 方孺牛 唐小平 卢会湘 严英占 金玉丰

传感技术学报2016,Vol.29Issue(4):467-473,7.
传感技术学报2016,Vol.29Issue(4):467-473,7.DOI:10.3969/j.issn.1004-1699.2016.04.001

基于低温共烧陶瓷的微机械差分电容式加速度计的研究

A Capacitive Micro-Accelerometer Based on LTCC Laminates

张义川 1缪旻 1方孺牛 2唐小平 3卢会湘 4严英占 4金玉丰4

作者信息

  • 1. 北京信息科技大学信息微系统研究所,北京100101
  • 2. 北京大学微米/纳米加工技术国家级重点实验室,北京100871
  • 3. 北京大学微米/纳米加工技术国家级重点实验室,北京100871
  • 4. 中国电子科技集团公司第五十四研究所,石家庄050081
  • 折叠

摘要

Abstract

With the development of the miniaturization and high density integration of electronic devices,Low Tem⁃perature Co-fired Ceramic(LTCC)technology is becoming the mainstream technology for microelectronic and micro/nano multifunctional device packaging and assembly. This paper presents a capacitive micro-accelerometer embed⁃ded into LTCC packaging substrate. Its square shaped proof mass of the sensing element is suspended in the center by four folded beams which are connected to the frame. The design,simulation,fabrication,and performance test of the accelerometer are discussed. High density multilayer wiring supported by LTCC microfabrication reduces the length of the interconnect line between sensing elements and circuitry and the associated parasitic capacitance. The signal detecting circuit based on the integrated chip solves the problem of large noise,circuit complexity,and so on. The test results show that the accelerometer has sufficient sensitivity and good linear relationship at low overload and the sensitivity is about 30.3 mV/gn.

关键词

低温共烧陶瓷/加速度计/微机械加工/三维集成/微系统

Key words

accelerometer/ceramic micromachining/three-dimensional integration/microsystem

分类

机械制造

引用本文复制引用

张义川,缪旻,方孺牛,唐小平,卢会湘,严英占,金玉丰..基于低温共烧陶瓷的微机械差分电容式加速度计的研究[J].传感技术学报,2016,29(4):467-473,7.

基金项目

国家自然科学基金项目(61176102,60976083,60501007,61404119);北京市属高等学校高层次人才引进与培养计划项目(CIT&TCD20150320);北京市自然科学基金项目 ()

传感技术学报

OA北大核心CSCDCSTPCD

1004-1699

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