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BiOClxI1-x 复合半导体的热稳定性及光催化性能

方稳 何洪波 薛霜霜 余长林 周晚琴

硅酸盐学报2016,Vol.44Issue(5):711-719,9.
硅酸盐学报2016,Vol.44Issue(5):711-719,9.DOI:10.14062/j.issn.0454-5648.2016.05.14

BiOClxI1-x 复合半导体的热稳定性及光催化性能

Thermostability and Photocatalytic Performance of BiOClxI1-xComposite Semiconductor

方稳 1何洪波 1薛霜霜 1余长林 1周晚琴2

作者信息

  • 1. 江西理工大学冶金与化学工程学院,江西 赣州 341000
  • 2. 福州大学,能源与环境光催化国家重点实验室,福州 350002
  • 折叠

摘要

Abstract

BiOClxI1-x composite semiconductor photocatalysts were synthesized by a solvothermal method. The thermostability of the materials and the relationships among their phase, morphology, light absorption and photocatalytic performance in degradation acid orangeⅡwere investigated by X-ray diffraction, scanning electron microscopy, N2-physical adsorption, thermal gravity analysis, Fourier transform infrared spectroscopy, and ultraviolet-visible diffusion reflectance spectroscopy, respectively. The results show that the thermostability of the BiOCl0.25I0.75 is much weaker than that of BiOCl and stronger than that of BiOI. In the calcination, a Bi5O7I phase appears with the gradual release of I element. After calcination at 500 ℃, the compound is mainly composed of bismuth oxychloride. Moreover, the spherical structure is destroyed and the surface area and the surface OH groups are lost. The photocatalytic activity of BiOCl0.25I0.75 and BiOCl0.50I0.50 are greater than that of BiOCl and BiOI. After high-temperature calcination, the photocatalytic activity decreases. The destruction of texture and the loss of surface area and I element can lead to the reduction in photocatalytic activity.

关键词

铋氧卤/热处理/稳定性/光催化

Key words

bismuth oxyhalide/heat treatment/stability/photocatalysis

分类

资源环境

引用本文复制引用

方稳,何洪波,薛霜霜,余长林,周晚琴..BiOClxI1-x 复合半导体的热稳定性及光催化性能[J].硅酸盐学报,2016,44(5):711-719,9.

基金项目

国家自然科学基金(21067004,21263005,21567008);江西省自然科学基金青年科学基金计划(20133BAB21003);江西省教育厅高等学校科技落地计划(KJLD14046);江西省青年科学家培养项目(20122BCB23015);江西省远航工程;2014江西省研究生创新资金项目(3104000089,3104100013);2013江西理工大学研究生创新资金项目(3104100039)。 (21067004,21263005,21567008)

硅酸盐学报

OA北大核心CSCDCSTPCD

0454-5648

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